FILM-FORMING DEVICE AND FILM-FORMING METHOD

摘要

Provided is a film-forming device comprising: a chamber which has a substrate disposed thereinside; a target which is disposed inside the chamber and contains a material from which a film is to be formed; a substrate support base which is disposed inside the chamber; a drive means which rotates the substrate support base; a sputtering cathode which causes sputtering particles to be incident upon the substrate from an oblique direction; and a control means which controls the drive means by setting a rotation period in such a way that the sputter film formation time required to form a film of the desired thickness is an integral multiple of the rotation period of the substrate support base.