SURFACE-MOUNTING CLIP

摘要

Disclosed is a surface-mounting clip which is provided with: a solder bonding section wherein the lower surface thereof is to be a solder bonding surface to be bonded with a solder to a conductor pattern on a printed circuit board; a pair of supporting sections, which are connected to the solder bonding section, and which are supported at positions above the printed circuit board at an interval between the supporting sections, said interval permitting a conductive member other than the printed wiring board to be inserted when the solder bonding section is bonded with the solder to the printed wiring board; and an elastic contact section, which is connected to at least one of the pair of supporting sections, is brought into contact with the conductive member with pressure by being elastically deformed when the conductive member is inserted into between the pair of supporting sections, and which electrically connects together the conductor pattern and the conducive member.