| 摘要 |
<P>PROBLEM TO BE SOLVED: To attain thinning of a semiconductor package while restraining the appearance impairment of the semiconductor package without carrying out resin burr eliminating work. <P>SOLUTION: The semiconductor package 100 includes a semiconductor chip 60, a lead frame 50 with the semiconductor chip 60 mounted on a die pad 52, and resin 10 sealing the semiconductor chip 60 and the die pad 52 from the upper and lower faces. The resin 10 has recesses 30 provided in a front face, and recesses 40 provided in a rear face and located inside the recesses 30 in a plan view. <P>COPYRIGHT: (C)2012,JPO&INPIT |
