In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
申请公布号
WO2012000114(A1)
申请公布日期
2012.01.05
申请号
WO2011CA50399
申请日期
2011.06.29
申请人
COOLEDGE LIGHTNING INC.;TISCHLER, MICHAEL;SCHICK, PHILIPPE;ASHDOWN, IAN;SHEEN, CALVIN WADE;JUNGWIRTH, PAUL
发明人
TISCHLER, MICHAEL;SCHICK, PHILIPPE;ASHDOWN, IAN;SHEEN, CALVIN WADE;JUNGWIRTH, PAUL