SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having multi-layer rewiring that can be mounted in a mounting substrate with high reliability.

SOLUTION: A semiconductor device comprises: a semiconductor substrate 10a having a bump electrode 18; a first insulation layer 20 arranged in the lateral direction of the bump electrode 18; a first wiring layer 30 that is formed on the first insulation layer 20 and connected to the bump electrode 18; a second insulation layer 22 formed on the first wiring layer 30; a via hole VH that is formed on the second insulation layer 22 and reaches the first wiring layer 30; a second wiring layer 32 that is formed on the second insulating layer 22 and connected to the first wiring layer 30 through a via conductor 40 formed in the via hole VH; and an external connection terminal 34 that is connected to the second wiring layer 32. The elastic modulus of the second insulation layer 22 is set to be lower than that of the first insulation layer 20.

COPYRIGHT: (C)2012,JPO&INPIT