发明名称 TAPE APPLYING DEVICE AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a tape applying device and method that can efficiently perform a tape releasing operation, and improve productivity while eliminating waste of a conducting tape. <P>SOLUTION: The tape applying method cuts a tape material 4 into individual pieces of conducting tapes 4b* and applies them to a plurality of application portions. The method selectively performs a precision-prioritized mode and a tact-prioritized mode. The precision-prioritized mode recurrently performs an operation for making a cut 4c on the tape material 4 by a cut part 7 and forming the individual pieces of the conducting tape 4b*, and an operation for applying the individual pieces of the conducting tape 4b*. The tact-prioritized mode continuously performs an operation for sequentially applying the individual pieces of the conducting tapes 4b* to each application portion of a substrate 20 while intermittently feeding the tape material 4 in a feed direction after the tape material 4 on which the number of necessary individual pieces of the conducting tapes 4b is preformed in sync with a substrate conveyance operation by which the substrate 20 is carried in or out. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012001285(A) 申请公布日期 2012.01.05
申请号 JP20100134762 申请日期 2010.06.14
申请人 PANASONIC CORP 发明人 YAMADA SHINGO;OKADA YASUHIRO
分类号 B65H37/04;B65H41/00;H01L21/60 主分类号 B65H37/04
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