发明名称 HEAT PUMP HEATING SYSTEM
摘要 A heat pump heating system (1A) includes: a refrigerant circuit (3) including a compressor (21), a radiator (22), and an expansion member (25A), and an evaporator (26); a circulation path (5) for circulating a liquid through the radiator (22) to produce a heated liquid; and a heater (4) for dissipating heat of the heated liquid. The refrigerant circuit (3) is provided with an internal heat exchanger (23A) for transferring heat from a high pressure refrigerant that has released heat in the radiator (22) to a low pressure refrigerant. The liquid flowing through the circulation path (5) is cooled in a liquid cooling heat exchanger (24) by means of the high pressure refrigerant flowing out of the internal heat exchanger (23A), before the liquid flows into the radiator (22).
申请公布号 US2012000236(A1) 申请公布日期 2012.01.05
申请号 US201013257205 申请日期 2010.04.07
申请人 OGATA TAKESHI;OKAICHI ATSUO;YAKUMARU YUICHI;HASEGAWA HIROSHI;PANASONIC CORPORATION 发明人 OGATA TAKESHI;OKAICHI ATSUO;YAKUMARU YUICHI;HASEGAWA HIROSHI
分类号 F25B30/00 主分类号 F25B30/00
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