| 摘要 |
The present invention relates to a component carrier tray, and more particularly, a thermoformed carrier tray for integrated circuit (IC) components such as IC chips. The trays of the present invention have the benefit of being suitable for all parts of the IC component manufacturing process, including being suitable for the steps of transporting, sorting, storing, baking, etc. Thus the trays of the present invention reduce the need for transferring IC components from one tray to another and as a result reduce manufacturing cost and risk of part damage. The trays of the present invention are particularly suitable for mid-temperature applications. |
| 申请人 |
LUBRIZOL ADVANCED MATERIALS, INC.;EDWARDS, KURT, S.;CHOO, CHUAN, TAT;LU, QIWEI;SIENKOWSKI, KENNETH;CHEW, KONG CHIN;MIRABILE, VANESSA |
发明人 |
EDWARDS, KURT, S.;CHOO, CHUAN, TAT;LU, QIWEI;SIENKOWSKI, KENNETH;CHEW, KONG CHIN;MIRABILE, VANESSA |
