| 摘要 |
<p>Disclosed is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients from each other and can have heat resistance against temperatures of 300°C or higher, vacuum airtightness and bonding strength, particularly which has excellent handling properties and workability. Specifically disclosed is a bonding material produced by mixing a Bi2O3-based fritted glass powder having an average particle diameter of 200 µm or less with at least one metal or alloy powder, wherein the at least one metal or alloy powder is selected from the group consisting of a metal powder mixture comprising a combination of metal Ga and/or Bi and Sn, a metal powder mixture comprising a combination of an alloy powder, Bi, Sn and Mg, and an alloy powder, and the at least one metal or alloy powder is mixed in an amount of 0.01 to 60 mass% relative to the amount of the fritted glass powder. The binding material may have a paste form by adding a solvent thereto. The bonding material enables the bonding of substrates having different thermal expansion coefficients from each other without causing cracking or detachment.</p> |
