METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and a semiconductor manufacturing device such that the number of times of transfer between the manufacturing devices is decreased and a wafer cracking risk is reduced.

SOLUTION: The method of manufacturing the semiconductor device includes the processes of forming a mark made of a non-single-crystalline reformed layer inside a back surface of a semiconductor wafer by irradiating the semiconductor wafer with laser light from the back surface; and exposing the reformed layer by subjecting the back surface of the semiconductor wafer to polishing or grinding processing after the process of forming the mark.

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