发明名称 |
Semiconductor Device and Method for Forming the Same |
摘要 |
A semiconductor device comprises a semiconductor substrate on an insulating layer; and a second gate, the second gate is located on the insulating layer and is embedded at least partially in the semiconductor substrate. A method for forming a semiconductor device comprises: forming a semiconductor substrate on an insulating layer; forming a void within the semiconductor substrate, with the insulating layer being exposed by the void; and forming a second gate, with the void being filled with at least one part of the second gate. It facilitates the reduction of the short channel effects, resistances of source and drain regions, and parasitic capacitances.
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申请公布号 |
US2012001229(A1) |
申请公布日期 |
2012.01.05 |
申请号 |
US201113121998 |
申请日期 |
2011.03.02 |
申请人 |
ZHU HUILONG;LIANG QINGQING;INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES |
发明人 |
ZHU HUILONG;LIANG QINGQING |
分类号 |
H01L29/788;B82Y40/00;B82Y99/00;H01L21/336 |
主分类号 |
H01L29/788 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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