| 发明名称 |
Method for Packaging Electronic Devices and Integrated Circuits |
| 摘要 |
The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits. |
| 申请公布号 |
US2012003791(A1) |
申请公布日期 |
2012.01.05 |
| 申请号 |
US201113231844 |
申请日期 |
2011.09.13 |
| 申请人 |
LEIB JUERGEN;YAMAMOTO HIDEFUMI;WAFER-LEVEL PACKAGING PORTFOLIO LLC |
发明人 |
LEIB JUERGEN;YAMAMOTO HIDEFUMI |
| 分类号 |
H01L21/52 |
主分类号 |
H01L21/52 |
| 代理机构 |
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| 地址 |
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