发明名称 |
SUBSTRATE LOAD AND UNLOAD MECHANISMS FOR HIGH THROUGHPUT |
摘要 |
In various exemplary embodiments described herein, a system includes a plurality of carrier arms each having concentrically mounted midpoints between opposing ends of the carrier arms with a wafer carrier mounted on each of the opposing ends of the carrier arms. A hub includes a plurality of concentrically mounted drives where each of the plurality of drives is coupled near the midpoint of a respective one of the plurality of carrier arms. Each of the plurality of drives is configured to be controlled independently of the remaining plurality of concentrically mounted drives. A respective motor is coupled to each of the concentrically mounted drives and is configured to move the coupled carrier arm in a rotary manner. A linear wafer transport mechanism moves wafers to or from select ones of the wafer carriers on the plurality of carrier arms to an easy handoff location for a load/unload robot. |
申请公布号 |
WO2011102952(A3) |
申请公布日期 |
2012.01.05 |
申请号 |
WO2011US22870 |
申请日期 |
2011.01.28 |
申请人 |
LAM RESEARCH CORPORATION;LENZ, ERIC, H. |
发明人 |
LENZ, ERIC, H. |
分类号 |
H01L21/677;B25J9/00;B25J19/00;B65G49/07 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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