| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus which can improve a cooling performance of a semiconductor device by using heat transmission via a sealing part. <P>SOLUTION: The power conversion apparatus 1 is constituted by laminating a plurality of semiconductor modules 2. The semiconductor module 2 comprises a semiconductor device 21, a heat sink 22, a sealing part 23, a wall part 24 and a penetrating coolant path 41. A plurality of semiconductor modules 2 are laminated in normal direction of a heat radiation surface 221. Semiconductor modules 2 arranged on both ends in the laminated direction are provided with lid parts 3. Creeping coolant path 42 are formed between neighboring semiconductor modules 2 and between lid parts 3 and semiconductor modules 2, and inside the wall part 24. The sealing part 23 is configured that a concavo-convex part 26 is provided on a side surface facing the penetrating coolant path 41. <P>COPYRIGHT: (C)2012,JPO&INPIT |
