| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a moisture-curable resin composition having excellent leveling properties before curing, becoming highly hard after curing, providing good adhesion to a metal and glass and inhibiting abnormal appearance due to curing shrinkage. <P>SOLUTION: The moisture-curable resin composition includes (A) 100 pts.mass of an organic polymer having a hydrolyzable silyl group, (B) 3-100 pts.mass of an epoxy resin, (C) a ketimine compound and (D) a curing catalyst for the hydrolyzable silyl group, wherein the ratio of the molar equivalent of the imino group possessed by the ketimine compound (C) to the molar equivalent of the epoxy group possessed by the epoxy resin (molar equivalent of imino group/molar equivalent of epoxy group) is 0.5-1.5, and at least 0.2 molar equivalent in the ketimine compound (C) is a ketimine compound obtained by a reaction between a ketone and a polyamine having a boiling point of ≥100°C and a melting point of ≤35°C at 1,013 hPa, and the viscosity of the composition at 23°C is 0.1-100 Pa s. <P>COPYRIGHT: (C)2012,JPO&INPIT |
