发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an insulator film consisting of oxide in high quality for a normally-off semiconductor element. <P>SOLUTION: A manufacturing method of a semiconductor substrate includes the step of forming an insulator film containing oxide on a substrate 3 having a semiconductor laminate structure. In the step, when depositing an elementary substance of an element or a compound of elements constituting the oxide on the substrate 3 having the semiconductor laminate structure, by precisely controlling and mixing water vapor pressure into hydrogen gas by means of heating or cooling of high purity water, composition of the oxide is precisely controlled by precisely controlling oxygen partial pressure oxidizing the elementary substance of the element or the compound of the elements. Thereby, the insulator film physicochemically adjusted to the substrate 3 having the semiconductor laminate structure is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012004513(A) 申请公布日期 2012.01.05
申请号 JP20100141003 申请日期 2010.06.21
申请人 NAGOYA INSTITUTE OF TECHNOLOGY 发明人 ODA OSAMU;EGAWA TAKASHI
分类号 H01L21/338;H01L21/316;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
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