| 摘要 |
PURPOSE: A metal printed circuit board for high heat radiation is provided to efficiently discharge heat from a device by removing an insulating layer in a region requiring heat radiation from a base material layer. CONSTITUTION: A metal layer(10) is formed in upper part the basic material plate(1) radiating heat. An insulating layer(20) is combined with one side of a metal layer through an insulating member. A circuit layer(30) is formed in one side of the insulating layer. A coating layer(35) is formed between one side having no the insulating layer and a first reflecting layer. The first reflecting layer(50a) is formed in the one side having no insulating layer and reflects light. A second reflecting layer(50b) is formed in the one side of the circuit layer.
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