| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a patterning method and a patterning apparatus which improve throughput and minimize manufacturing cost of a semiconductor device. <P>SOLUTION: The patterning method includes a step for forming a first pattern in a first region on a substrate to be processed, a step for applying a plurality of kinds of block copolymers having different compositions to a second region different from the first region, and a step for forming by heat treatment a second pattern consisting of a plurality of kinds of structures based on the plurality of kinds of block copolymers thus applied. <P>COPYRIGHT: (C)2012,JPO&INPIT |
