发明名称 |
METHODS AND APPARATUS FOR THERMAL BASED SUBSTRATE PROCESSING WITH VARIABLE TEMPERATURE CAPABILITY |
摘要 |
A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap. |
申请公布号 |
US2012003388(A1) |
申请公布日期 |
2012.01.05 |
申请号 |
US201113169373 |
申请日期 |
2011.06.27 |
申请人 |
TZU GWO-CHUAN;YUAN XIAOXIONG;KHANDELWAL AMIT;WANG BENJAMIN CHENG;GELATOS AVGERINOS V.;WU KAI;KARAZIM MICHAEL P.;LIN JING;CUVALCI OLKAN;APPLIED MATERIALS, INC. |
发明人 |
TZU GWO-CHUAN;YUAN XIAOXIONG;KHANDELWAL AMIT;WANG BENJAMIN CHENG;GELATOS AVGERINOS V.;WU KAI;KARAZIM MICHAEL P.;LIN JING;CUVALCI OLKAN |
分类号 |
C23C16/455;B05C11/00;C23C16/06;C23C16/458;C23C16/46;C23C16/52 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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