Metallization useful for ceramic to apply a structural element via die- or wire-bonding process, and housing, comprises a base layer exhibiting metal, adhesive layer comprising palladium, and solderable layer of non-ferromagnetic material

摘要

Metallization for a ceramic (10) comprises: a base layer (12) exhibiting a metal; an adhesive layer (14), which comprises palladium, and exhibits a layer thickness of 0.1-5 mu m; a solderable layer (16) of a non-ferromagnetic material, where the material of the adhesive layer is different from the material of the solderable layer; and an oxidation protecting layer (20). Independent claims are also included for: (1) the ceramic comprising the metallization; and (2) a cavity housing for receiving a structural element comprising a bottom portion and a covering part, respectively exhibiting the ceramic.