LIGHT-EMITTING DIODE MODULE

摘要

The present invention relates to a light-emitting diode (LED) module capable of effectively dissipating heat generated by an LED device. For this purpose, the LED module according to the present invention comprises: a metal substrate; an insulation layer formed on a first region of the metal substrate; a first conductive layer formed on a second region of the metal substrate; a second conductive layer formed on the insulation layer; a first lead frame formed on the first conductive layer; a second lead frame formed on the second conductive layer; and an LED device disposed on the first and second lead frames.