发明名称 LIQUID TREATMENT DEVICE FOR SUBSTRATE, LIQUID TREATMENT METHOD FOR SUBSTRATE, AND RECORDING MEDIUM WITH RECORDED LIQUID TREATMENT PROGRAM FOR SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To prevent a rinse liquid from scattering during rinsing treatment of a substrate by preventing thermal deformation of the substrate and reaction of a treatment liquid with the rinse liquid. <P>SOLUTION: In liquid treatment for the substrate where after the surface of the substrate is treated with a treatment liquid, the surface is treated with a rinse liquid having a temperature lower than that of the treatment liquid, intermediate treatment to make the temperature of the surface of the substrate lower than the liquid temperature of the treatment liquid and higher than the liquid temperature of the rinse liquid is performed between the liquid treatment and the rinse treatment. In the intermediate treatment, an intermediate treatment liquid having a temperature lower than the liquid temperature of the treatment liquid and higher than the liquid temperature of the rise liquid is supplied to the substrate. The intermediate treatment liquid is supplied only to the back of the substrate. The substrate is rotated with the supply of the treatment liquid and the rinse liquid stopped. A mixture of one or more kinds of chemicals for performing chemical reaction causing generation of reaction heat is supplied, as a treatment liquid, to the substrate during the liquid treatment, and supply of some of the chemicals is stopped during the intermediate treatment. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012004539(A) 申请公布日期 2012.01.05
申请号 JP20110065807 申请日期 2011.03.24
申请人 TOKYO ELECTRON LTD 发明人 INADA TAKASHI;OKAMURA NAOYUKI;YANO HIDETSUGU;YATSUYA YOSUKE
分类号 H01L21/027;H01L21/304 主分类号 H01L21/027
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