| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing apparatus capable of performing laser processing and cutting and capable of improving productivity by efficiently operating a laser processing mechanism. <P>SOLUTION: A processing apparatus 1 comprises: holding means 2 for holding a workpiece; cutting means 3 for cutting the workpiece held by the holding means 2; and laser processing means 4 for processing the workpiece held by the holding means 2 by irradiating the workpiece with a laser beam. The holding means 2 includes a first holding table 2a and a second holding table 2b. The cutting means 3 includes a first cutting part 3a having a first cutting blade 30a and first cutting water supply means 32b for supplying cutting water to the first cutting blade 30a; and a second cutting part 3b having a second cutting blade 30b and second cutting water supply means 32b for supplying cutting water to the second cutting blade 30b. The laser processing means 4 includes an oscillator that oscillates a laser beam and a processing head 40 that collects the oscillated laser beams from the oscillator. <P>COPYRIGHT: (C)2012,JPO&INPIT |
