LAMINATE FOR CIRCUIT BOARD AND METALLIC BASE CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To simultaneously attain high withstand voltage and high peel strength.

SOLUTION: This method for manufacturing a laminate for a circuit board includes steps of: transferring an insulation layer 3' which is formed on a support 5 and contains electrical insulating resin 3a', an electrical insulating inorganic filler 3b and arbitrarily contains solvent from the support 5 to metal foil; and sticking the metal foil and a metal substrate together by sandwiching the insulation layer 3' between them.

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