| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an evaluation apparatus which can evaluate heat shock strength of a sample such as a wafer more stably and accurately than prior art. <P>SOLUTION: The apparatus that evaluates heat shock resistance of a brittle material comprises a mounting table on which a sample of brittle material is mounted, a heating furnace in which the sample is heated, conveyance means for conveying the mounting table and the sample into the heating furnace, and drop weight means for dropping a weight onto the sample in the furnace. After the sample is mounted on the mounting table, and the mounting table and the sample are conveyed into the heating furnace by the conveyance means, the sample is heated and then the drop weight can be dropped toward the sample in the heating furnace by the drop weight means. <P>COPYRIGHT: (C)2012,JPO&INPIT |
