发明名称 SUBSTRATE LIQUID PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To recover processing liquid supplied onto the surface of a substrate well regardless of the rotational speed of the substrate. <P>SOLUTION: The substrate liquid processing apparatus (1) which processes a rotating substrate (2) by supplying processing liquid thereto comprises a turntable (28) which rotates the substrate (2) while holding it horizontally, an annular recovery cup (39) disposed on the lower periphery of the substrate (2) in order to recover the processing liquid supplied to the substrate (2), a recovery groove (44) formed between the inner peripheral wall (43) and the outer peripheral wall (42) of the recovery cup (39), and a cup cover (47) arranged on the inner peripheral wall (43) of the recovery cup (39) to stretch obliquely inward toward the recovery groove (44). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012004310(A) 申请公布日期 2012.01.05
申请号 JP20100137516 申请日期 2010.06.16
申请人 TOKYO ELECTRON LTD 发明人 WAKIYAMA TERUFUMI;ITO NORIHIRO
分类号 H01L21/304;H01L21/306 主分类号 H01L21/304
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