| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of estimating a junction film, which can accurately estimate how well the adhesiveness of the junction film is, that is, whether a base material can be solidly joined to an adherend through the junction film. <P>SOLUTION: The method of estimating the junction film 3 is used for estimating the junction film 3 comprising an Si skeleton and a leaving group configured by an organic group. The junction film 3 exhibits its adhesiveness to a counter substrate 4 (other adherends) on a surface thereof, by applying energy to desorb the leaving group from the Si skeleton. The method includes: measuring the junction film 3 before and after applying the energy by an infrared absorption spectrum method to obtain peak intensities attribute to a methyl group when peak intensity attributed to Si-O-S bond is 1; comparing the obtained peak intensities attributed to the methyl group, the peak intensities being obtained before and after applying the energy; and estimating the adhesiveness to the counter substrate 4 of the junction film 3 based on the comparison results. <P>COPYRIGHT: (C)2012,JPO&INPIT |
