| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate filling of an underfill material without fear of causing failure of a device. <P>SOLUTION: In a method of manufacturing a semiconductor device, a coating layer 15 which exhibits an affinity for a filler 16 to be filled into a space between first and second bases 11 and 12 is formed on at least one of the surfaces of the first and second bases 11 and 12 facing each other, and the filler 16 is then filled into the space between the first and second bases 11 and 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
