| 摘要 |
According to one embodiment, a light-emitting module includes a substrate, a light-emitting element, a light distribution control member, and a cover. The substrate includes a surface on which a thermally conductive portion and a interconnect pattern are formed. The light-emitting element is thermally connected to the thermally conductive portion, is electrically connected to the interconnect pattern, and generates heat while emitting light. The light distribution control member is thermally connected to the thermally conductive portion at a periphery of the light-emitting element, includes a ridge portion formed on an exit side where light emitted from the light-emitting element is projected, and is configured to control distribution of the light emitted from the light-emitting element. The cover is thermally connected to the ridge portion and configured to pass therethrough the light emitted from the light-emitting element. |
