| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stack type imaging device that has pixels made fine without making thinner the thickness of a signal processing substrate on which signal processing elements are formed. <P>SOLUTION: The imaging device includes a photoelectric conversion element array (1) having a plurality of photoelectric conversion elements arrayed in a two-dimensional matrix, and a signal processing element array (2) which is coupled to the photoelectric conversion element array and has a plurality of signal processing elements arrayed in a two-dimensional matrix as well. Assuming (k) to be a positive integer which is equal to or larger than 2, the photoelectric conversion elements are formed along a column direction to an array density which is (k) times as large as the array density of the signal processing elements, the signal processing elements are formed along a row direction orthogonal to the column direction to an array density which is (k) times as large as the array density of the photoelectric conversion elements, and the respective photoelectric conversion elements are electrically connected to the corresponding signal processing elements through wiring conductors. <P>COPYRIGHT: (C)2012,JPO&INPIT |
