| 摘要 |
<P>PROBLEM TO BE SOLVED: To measure thermal conductivity on a condition close to that of an actual device. <P>SOLUTION: A heat spreader 26 has a principal surface 26a and a principal surface 26b which are opposed to each other. On the principal surface 26a of the heat spreader 26, a spacer 28 is disposed. The spacer 28 has higher thermal resistivity than that of the heat spreader 26. On the spacer 28, a thermocouple 30 is placed. On the principal surface 26b of the heat spreader 26, a thermocouple 32 is placed. The heat spreader 26 is sandwiched between a cooling plate 18 and a heat dissipation surface 16 of a power module 10. Between the heat dissipation surface 16 of the power module 10 and the principal surface 26a of the heat spreader 26, a thermal grease 20 is disposed. The thermocouple 30 is in contact with the heat dissipation surface 16. <P>COPYRIGHT: (C)2012,JPO&INPIT |
