| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy low in the residual stress upon solidification, having a high bonding strength and high reliability, and capable of suppressing the reaction of Ni with Bi and diffusion of Ni when bonding an electronic component or a substrate each including Ni. <P>SOLUTION: There is provided the Pb-free solder alloy with Bi as a principal component, which: contains 21.0-30.0 mass% of Zn; does not contain more than 3.0 mass% of Al; does not contain more than 10.0 mass% of Sn; and does not contain more than 0.5 mass% of P. This Pb-free solder alloy may contain at least one of Al, Sn and P, wherein, 0.02 mass% or more in the case of Al, 0.3 mass% or more in Sn, and 0.001 mass% or more in P. <P>COPYRIGHT: (C)2012,JPO&INPIT |
