| 摘要 |
<p>A printed circuit board assembly process is provided and a method for enhancing chip spot weld reliability, a printed circuit board and an electron device are provided. The method for enhancing chip spot weld reliability includes that: an epoxy flux is dipped on the leg of chip; or an epoxy flux is coated on the pad, which is corresponding to leg of chip; the chip sticks to pad; reflowing the pad which sticks the chip; the epoxy flux is solidified. The under fill process is not needed, and thereby the cost of equipment is reduced, the manufacturing efficiency is increased.</p> |
