SUBSTRATE FOR POWER MODULE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a power module and a manufacturing method thereof which joins a metal layer and a heat sink without causing separation of a ceramic substrate and the metal layer thereby improving junction reliability.

SOLUTION: In a substrate for a power module 3, metal layers 6 and 7 are laminated on both surfaces of a ceramic substrate 2, and the metal layer 7 on one surface is joined with a heat sink. A protrusion 9 protruding from a side surface 7a of the metal layer 7 is provided over the whole periphery of the side surface 7a.

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