| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent damage to an electronic component by a simple structure. <P>SOLUTION: A wire spring 43 is fixed to a holding frame 42, is located above a substrate 411, and extends linearly in a longitudinal direction from one end to the other end of the substrate 411. Contact parts 431 are provided in contact with side frames 151 and formed to protrude from the holding frame 42 by bending the wire spring 43. <P>COPYRIGHT: (C)2012,JPO&INPIT |
