THREE-DIMENSIONAL SHAPE MEASURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a three-dimensional shape measuring device that removes a curvature component of a light cutting line to accurately calculate cross-sectional shape data of a solar cell wafer.

SOLUTION: A wafer shape data acquisition part 221 acquires wafer shape data defining a shape of a light cutting line from a wafer image. A standard planar shape data acquisition part 222 varies height of a standard plane through several levels to acquire standard planar shape data defining a shape of a light cutting line at each level from a standard planar image. A shape correction part 341 specifies standard planar shape data of a shape most resembling the wafer shape data from a standard planar shape data storage part 80 and calculates difference between the specified standard planar shape data and the wafer shape data as corrected wafer shape data. A cross-sectional shape calculation part 342 calculates cross-sectional data of the wafer from the corrected wafer shape data calculated in the shape correction part 341.

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