METHOD FOR SCRIBING BRITTLE MATERIAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for scribing a brittle material substrate capable of processing the brittle material substrate by internal cutting without externally cutting the brittle material substrate in spite of using a normal cutter wheel when a scribe line is formed to the brittle material substrate.

SOLUTION: In the method for scribing the brittle material substrate for forming the scribe line to the brittle material substrate by tumbling the cutter wheel on the brittle material substrate, a trigger (initial crack) becoming the starting point of a scribe is formed at the place entering inside from one end edge of the substrate on the surface of the substrate and the cutter wheel is subsequently tumbled along a scribe scheduled line from the position where the trigger is formed to form the scribe line.

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