| 摘要 |
<P>PROBLEM TO BE SOLVED: To inspect a state of solder with high accuracy and at a high speed. <P>SOLUTION: A solder inspection method is the method for inspecting the state of a solder 24 to join a lead 23 of an electronic component 22 inserted to a lead hole 21 of a substrate 20 with the substrate 20, and to be performed as follows. Light is radiated from the upper part of the solder 24 so as to allow reflection light from the flat part of the solder 24 in parallel with the front surface of the substrate 20 to be more intensively made incident to a camera 1 positioned in the upper part of the solder 24 compared with reflection light from the inclined part of the solder 24. The solder 24 is imaged by the camera 1, so as to inspect the state of the solder 24 based on the luminance of a prescribed inspection window 32 within an image imaged by the camera 1. The inspection window 32 is at least a part of a region positioned on the outer side of an outer periphery of the lead 23 in the imaged image. <P>COPYRIGHT: (C)2012,JPO&INPIT |
