发明名称 HEAT RADIATION INSULATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiation insulating substrate in which a ceramic layer, a first metallic layer disposed on one side of the ceramic layer, and a second metallic layer disposed on the opposite side to the ceramic layer disposing side of the first metallic layer and including Ni as an essential element are joined and integrated in a laminating shape, and capable of preventing occurrence of problems such as warpage, cracking, and peering of the insulating substrate. <P>SOLUTION: A heat radiation insulating substrate includes a superelastic alloy layer 4 interposed between a first metallic layer 3 and a second metallic layer 5 of the insulating substrate 1A. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012004534(A) 申请公布日期 2012.01.05
申请号 JP20110013283 申请日期 2011.01.25
申请人 SHOWA DENKO KK 发明人 OTAKI ATSUSHI;UNENO DAISUKE;OYAMA SHIGERU
分类号 H01L23/36;H01L25/07;H01L25/18 主分类号 H01L23/36
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