| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving reliability and reducing manufacturing cost. <P>SOLUTION: An insulating substrate 12 is provided on a base plate 10 and a wiring pattern 14 is provided on the insulating substrate 12. A power module 16 is mounted on the wiring pattern 14. A conductive presser plate 18 presses the power module 16 to the wiring pattern 14 from the top to fix. These are covered with a case 24. A P-side electrode 26 is connected to the wiring pattern 14 and an N-side electrode 28 is connected to the presser plate 18, each protruding outside the case 24. A corrector electrode 36 of a switching element 30 is bonded to a base wiring plate 34 and an emitter electrode 40 of the switching element 30 is bonded to an N-side conductive plate 44. The bottom of the base wiring plate 34 protrudes from the bottom surface of a mold resin 52 and contacts the wiring pattern 14. The upper portion of the N-side conductive plate 44 protrudes from the top surface of the mold resin 52 and contacts the presser plate 18. <P>COPYRIGHT: (C)2012,JPO&INPIT |
