| 摘要 |
In a package for a semiconductor device according to the present invention, coating resin 10 covers the boundaries between lead frames 1 and 2 and holding resin 6, at exposed portions in the opening of a resin part 3, thereby closing gaps 18 between the lead frames 1 and 2 and the holding resin 6. Thus it is possible to suppress leakage of molding resin and intrusion of outside air or moisture from the gaps 18 between the lead frames 1 and 2 and the holding resin 6. Particularly, blocking of moisture can prevent the package from being damaged by expansion and contraction of moisture. |
