发明名称 |
DIODE ARRAY AND METHOD FOR PRODUCING A DIODE ARRAY |
摘要 |
The invention relates to a diode array (10) comprising a diode (11) and two electrodes (14, 15). Each of said electrodes is connected to the diode in an electrically conductive manner by means of a soldered connection on one of the two opposite contact surfaces of said diode. The contact surfaces of the diode are formed substantially by the surfaces of an underside (19) and an upper side (18) of the diode, and these make contact with the connection extensions (12, 13) of the electrodes via the soldered connection. Said connection extensions and the contact surfaces of the diode form substantially congruent counter contact surfaces (24, 25). |
申请公布号 |
WO2011032538(A3) |
申请公布日期 |
2012.01.05 |
申请号 |
WO2010DE01082 |
申请日期 |
2010.09.15 |
申请人 |
PAC TECH - PACKAGING TECHNOLOGIES GMBH;ZAKEL, ELKE;TEUTSCH, THORSTEN;AZDASHT, GHASSEM |
发明人 |
ZAKEL, ELKE;TEUTSCH, THORSTEN;AZDASHT, GHASSEM |
分类号 |
H01L21/60;H01L23/495 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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