| 摘要 |
PURPOSE: A chip-on-film package and a method for testing the same are provided to verify the contact state of test pads and test probes based on the contact state of an alignment pad and an identification probe. CONSTITUTION: A plurality of electrode lines(110, 120) is formed at the upper side of a base film(100) to be arranged on the base film. A chip(150) is bonded with the electrode lines. A protective film(130) surrounds the electrode lines and is formed on the upper side of the base film. Both ends of the electrode lines are exposed. Alignment pads(190a, 190b) identify the contact state of test probes with respect to test pads. |
