发明名称 CURABLE RESIN COMPOSITION, LED PACKAGE, AND METHOD FOR PRODUCTION OF THE LED PACKAGE, AND OPTICAL SEMICONDUCTOR
摘要 The curable resin composition of the present invention comprises a polyol component containing tri- or higher functional polycaprolactone polyol; and a polyisocyanate component containing bifunctional or trifunctional alicyclic isocyanate having one or more chemical structures in which an isocyanate group is bonded to a secondary carbon atom.
申请公布号 EP2141185(A4) 申请公布日期 2012.01.04
申请号 EP20080751978 申请日期 2008.04.23
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TOMIYAMA, TAKEO;TANAKA, SHOUKO;YOSHIDA, AKIHIRO;KOBAYASHI, SHINGO
分类号 C08G18/42;B29C45/02;B29C45/14;B29K101/10;C08G18/10;C08K5/13;C08L75/04;H01L33/00;H01L33/56 主分类号 C08G18/42
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