发明名称 |
STACKED DIE PACKAGE |
摘要 |
Methods are provided for forming a die package. The method comprises stiffening a flexible substrate to provide a first flexibility of the flexible substrate, forming a mounting element on a first side of the flexible substrate, and mounting a first side of a die on a second side of the flexible substrate. In addition, the method comprises adjusting the stiffening to provide a second flexibility of the flexible substrate that is greater than the first flexibility, and positioning the flexible substrate to couple a contact of the flexible substrate with a second side of the die. |
申请公布号 |
EP1350270(B1) |
申请公布日期 |
2012.01.04 |
申请号 |
EP20010270907 |
申请日期 |
2001.11.27 |
申请人 |
MEDTRONIC, INC. |
发明人 |
MILLA, JUAN, G.;HUBBARD, ROBERT, L. |
分类号 |
H01L25/065;H01L21/60;H01L21/68;H01L21/98;H01L23/498;H01L23/538;H05K3/34 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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