| 摘要 |
PURPOSE: An emitting device and a manufacturing method thereof, and a light emitting device package and a lighting system are provided to improve luminous efficiency of the emitting device by alleviating a phenomenon that current is focused to a minimum distance between a conductivity bearing substrate and an electrode. CONSTITUTION: A light emitting structure layer(135) is formed on a conductivity supporting member(175). The light emitting structure layer comprises a first conductivity type semiconductor layer(110), an active layer(120), and a second conductivity type semiconductor layer(130). An electrode(115) is formed on the light emitting structure layer. A passivation layer is formed in a side of the light emitting structure layer. The passivation layer is formed into ultraviolet ray hardened adhesive. A protective layer(140) is formed between the conductivity supporting member and the light emitting structure layer.
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