发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
PURPOSE: A method for manufacturing a semiconductor device, a substrate processing method, and a substrate processing apparatus are provided to form an insulation layer with high thickness uniformity of a film and reduce hydrogen density of the film. CONSTITUTION: Source gas including preset elements is supplied to a process container with a substrate. The source gas is supplied to the substrate through a nozzle installed on the side of the substrate. A preset element containing layer is formed on the substrate. The preset element containing layer is changed into a nitrification layer by supplying nitrogen-containing gas to the process container. The nitrification layer with a preset film thickness is formed on the substrate by supplying inactive gas to the process container.
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申请公布号 |
KR20120001619(A) |
申请公布日期 |
2012.01.04 |
申请号 |
KR20110060696 |
申请日期 |
2011.06.22 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
OTA YOSUKE;HIROSE YOSHIRO;AKAE NAONORI;TAKASAWA YUSHIN |
分类号 |
H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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