| 摘要 |
<p>In conventional electronic component mounting boards, a leg section of a metal frame manufactured of a metal block attached to a circuit board is firmly adhered to a board with a solder and the like, and heat due to light emission of a LED element is dissipated through the leg section of the metal frame, and heat dissipation performance is improved. In the conventional electronic component mounting boards, however, high heat conductance of the metal frame is not efficiently exhibited due to existence of an adhesive layer and the like having a lower heat conductance. In order to improve a certain limit existed in luminance and lifetime due to temperature increase of the LED element, a frame having heat conductance is attached on an upper plane of a circuit board whereupon a plurality of conductors are formed, and the frame and one of the conductors of the circuit board are heat-conductively connected. Thus, heat from the semiconductor element (LED element) is efficiently dissipated directly or indirectly to the external air, through the conductor heat-conductively connected with the frame.</p> |
