| 摘要 |
<p>The central region of a leadframe ( 101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101, 1201 ), is selectively etched to leave upright portions ( 104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204 ). Subsequently, during the packaging process, an integrated circuit ( 3 ) is located on the central region of the leadframe, and wires ( 107 ) are formed between the upright portions of the leadframe and contacts ( 5 ) of the integrated circuit ( 3 ), which are to be grounded. Subsequently, the wires and upright portions of the leadframe are encased in resin ( 116 ). Since the upright portions of the leadframe are encased in resin, the resin ( 116 ) is mechanically locked to the leadframe. Furthermore, any delamination that occurs between the resin ( 116 ) and the leadframe cannot propagate easily up the sides of the upright portions as far as the wires ( 107 ), so the wires ( 107 ) are unlikely to be torn from the upright portions ( 104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204 ). Any adhesive that leaks from under the integrated circuit ( 3 ) when the integrated circuit ( 3 ) is mounted on the leadframe, is most unlikely to cover any part of the upper surface of the upright portions.</p> |
