HIGH PRECISION PATTERN COPPER ELECTRODEPOSITS, COPPER ELECTROPLATING SOLUTION AND PLATING METHOD FOR HIGH PRECISION PATTERN COPPER ELECTRODEPOSITS

摘要

PURPOSE: A copper plated structure having high-precision patterns, a copper plating solution, and a forming method thereof using the copper plating solution are provided to reduce manufacturing costs by controlling the width and thickness of the copper plated structure. CONSTITUTION: A copper plated structure having high-precision patterns is formed using a copper plating solution. The copper plating solution is composed of organic additive comprising CuSO4 0.26-1M, H2SO4 0.5-2M, TU(CH4N2S), and SVH(C10H13NO3S). The line width of the copper plated structure is 1.3 times or less of the width of a master. The thickness of the copper plated structure is less than 20 micrometers.